Quality Control Center
Our in-house lab and local partnerships in Huaqiangbei ensure 100% genuine parts for your production line.
LEVEL 01
External Visual Inspection
Every batch undergoes rigorous visual analysis using high-resolution digital microscopes (up to 200x). Our specialists check:
- Laser Marking consistency & Original Font verification
- Package/Case integrity (No resurfacing or sanding marks)
- Lead/Ball condition (Oxidation check & Co-planarity measurement)
- Acetone/Solvent Test (Re-blacktop and remarking detection)
LEVEL 02
Non-Destructive X-Ray Inspection
Advanced real-time imaging to ensure internal silicon architecture matches the specification without opening the package.
- Bond Wire Analysis (Check for consistency and broken wires)
- Die Frame Verification (Matches manufacturer's lead-frame pattern)
- XRF Analysis (Full RoHS Lead-Free compliance scan)
Professional Partnered Lab
For critical military, aerospace, and medical grade components, we partner with industry-leading 3rd party labs in Shenzhen to provide:
- X-Ray Inspection (Internal Die Verification)
- De-cap Testing (Internal Architecture Analysis)
- Solderability Testing (Terminal Integrity)
- Comprehensive Testing Reports (English PDF)
[X-Ray Scanner Photo]
[Die Shot Photo]
[Testing Rig Photo]
[Packing ESD Photo]